Providing Heat Dissipation (dart)
You must provide sufficient heat dissipation to keep
the temperature of your Basler dart camera module within the specified
range.
General Guidelines
Since each installation is unique, Basler only provides the following
general guidelines:
- Mount a lens on the camera module.
- Monitor the temperature of the camera module using the appropriate
temperature measurement
point.
- On all dart camera modules, there are four holes at the corners
of the board, designed for installing the module. You can also use
the holes to dissipate heat.
- Depending on the dart variant, different components are used to
dissipate heat:
- Bare board variants: The metallic borders
of the holes are designed to dissipate heat to connecting metallic
components.
- S-mount and CS-mount variants:
Rivets are placed in the four holes. These rivets can be used
to dissipate heat towards connected metallic components. How to
use the holes or rivets depends on your system design. In all
cases, make sure that the holes or rivets have good contact with
metallic components in your system. This way, the heat can dissipate
towards the metallic components.

Examples of how you can provide heat dissipation:
- The use of a fan to provide air flow over the camera module is
an efficient method of heat dissipation.
- The camera front is connected to a mounting plate. Heat dissipates
via the rivets, the camera front and the mounting plate.

- The camera rear is connected to a mounting plate. Heat dissipates
via the rivets and the mounting plate.

dart USB 3.0
Bare Board Models

S-Mount and CS-Mount Models

dart BCON for LVDS
Bare Board Models

S-Mount and CS-Mount Models

dart BCON for MIPI
Bare Board Models

S-Mount Models
